Creating a Software Engineering-based Factory
YouTube Link: https://youtu.be/7w6MNQCtMpM
Introduction
As a concept and introduction, there are several aspects that are both evolving and congealing to help developers in U.S. industries create a software engineering factory. Each of the components addressed in this brief paper can be quite complex on their own. However, this discussion is to demonstrate on a high-level conceptual basis the possible blending of six aspects, when articulated, can achieve a modern day and supportive software engineering environment for industry, and in particular, the semiconductor packaging industry. This high-level concept model is built upon several innovative aspects including:
1. Semiconductor Packaging (Packaging)
2. Industry 4.0 (e.g., Manufacturing 4.0)
3. Web 3.0 technologies
4. The decentralized organization (DAO)
5. Software Factory concept
6. Verification and Validation (V&V)
Semiconductor packaging
Semiconductor packaging involves the use of various substrates including metal, plastic, glass, or ceramic casing containing one or many discrete integrated circuits and semiconductor devices. While individual components are fabricated prior to die sectioning and testing, the resulting components are packaged to provide better performance based on environmental and platform factors. While there are thousands of packaging types for semiconductors and integrated circuits, packaging is generally defined by the requirements of the user, the environment that the semiconductor operates in and other standards that include international, governmental (DoD), national, or industry standards.
Evolving standards that are to be identified included background radiation, high density/low emissions, substrate selection for optimal performance, transient error tolerance levels, and other aspects that must be specified. In addition, spaceflight and military applications for semiconductor packaging applications use hermetically packaged microcircuits (HPM) and, more recently, plastic (and glass) encapsulated microcircuits (PEM), which have ever-evolving standards.
Industry 4.0 (Manufacturing 4.0)
Industry 4.0 is a framework that conceptualizes rapid technological change to industries and the resultant processes that are used by, in this instance, manufacturers. Industry 4.0 boasts increased interconnectivity and smart automation in and between manufacturers. Industry 4.0 can be inferred as Manufacturing 4.0 in this context.
A challenge to Manufacturing 4.0 is the effective integration of Artificial Intelligence, robotics, and other technologies to foster automation while enhancing the efficacy for semiconductor packaging. The blending of technologies to support Manufacturing 4.0, in conjunction with other technologies such as blockchain, the Internet of Things, Machine to Machine (M2M) communication, serves to increase automation, self-monitoring of Verification and Validation of the product, and the use of smart machines can analyze and diagnose issues without the need for human intervention.
Web 3 technologies
Web3 (Web 3.0) is an idea for a new iteration of the World Wide Web that incorporates concepts including decentralization and blockchain technologies that can be leveraged by Industry 4.0 (and manufacturing 4.0). With Web 2.0, data and content are often centralized in a small cluster of related companies, that often has the issue of stifling innovation due to ineffective data sharing and slow systemic change, as the given group of companies involved in one technological market aspect may tend to become more rigid, to support cohesiveness within the group, as the group grew.
The decentralized organization (DAO)
A decentralized autonomous organization (DAO), sometimes called a decentralized autonomous corporation (DAC), is an organization with defined rules that are encoded onto a blockchain that is controlled by the organization’s members and not influenced by a central government or other outside agencies. DAOs are member-owned communities of practice without centralized leadership.
The use of Web 3.0 will offer the possibility of a Decentralized Autonomous Organization (DAO) that is based on rules encoded into and supported by blockchain technologies and can speed up the organization-to-organization and organization to shop-floor communication. The DAO will be controlled by the organization’s members and are member owned, while the financial transaction records, program rules, and other rules of organizational engagement are maintained on a blockchain shared, managed, and monitored by the DAO partner organizations.
Software Factory
A software factory is a structured collection of related software assets that supports the production and distribution of software components based on specific, externally defined end-user requirements. A software factory applies modern manufacturing techniques to the development and deployment of software.
A software factory incorporates extensive tools, processes, and content using a schema to automate the development and distribution of software. In addition, the software factory application development addresses the problem of traditional development (such as the SDLC and the SSDLC and other rapid-development models) where applications are developed and delivered without taking advantage of the knowledge gained by engineers and cybersecurity specialists. The use of a software factory will leverage prior software module and security development for firmware, component, and application development throughout the Semiconductor packing environment using a Manufacturing 4.0 and Software Factory process.
Verification and Validation
Verification and validation (V&V) are independent procedures that are used together for checking that a product, service, or system meets the requirements and specifications that are specified by the user and design community. The Institute of Electrical and Electronics Engineers (IEEE) has adopted the Project Management Institute’s PMBOK (Project Management Body of Knowledge), which defines V&V as the following:
- “Validation. The assurance that a product, service, or system meets the needs of the customer and other identified stakeholders. It often involves acceptance and suitability with external customers. Contrast with verification.”
- “Verification. The evaluation of whether or not a product, service, or system complies with a regulation, requirement, specification, or imposed condition. It is often an internal process. Contrast with validation.”
While V&V is often an aspect of a quality management process, such as ISO 9000, the V&V process can be expanded to include proper provisioning of components and processes used. In this instance, semiconductor packaging through a V&V process is verified that a given module or component fulfills its intended purposed, and components are sourced from approved vendors and suppliers. V&V can be an essential part of the DAO construct and can be mitigated by the use of blockchain technologies that support not only V&V, but the software factory and semiconductor packaging requirements set forth by the user community (e.g. the DoD and manufacturers, at large) and other governmental mandates, regulations, and requirements.
Summary
As a point of conclusion, industry in the United States is shifting to a more domestic calling. The concept in this brief paper generally outlines a possible articulation between six highly technical aspects that can be leveraged to support industry, and in particular the semiconductor industry.
About the Author
Ron McFarland, PhD, CISSP is a Senior Cybersecurity Consultant at CMTC (California Manufacturing Technology Consulting) in Torrance, CA. He received his doctorate from NSU’s School of Engineering and Computer Science, MSc in Computer Science from Arizona State University, and a Post-Doc graduate research program in Cyber Security Technologies from the University of Maryland. He taught Cisco CCNA (Cisco Certified Network Associate), CCNP (Cisco Certified Network Professional), CCDA (Design), CCNA-Security and other Cisco courses and was honored with the Cisco Academy Instructor (CAI) Excellence Award in 2010, 2011, and 2012 for excellence in teaching. He also holds multiple security certifications including the prestigious Certified Information Systems Security Professional (CISSP) certification and several Cisco certifications.
CONTACT Dr. Ron McFarland, PhD, MSc, CDNA, CISSP
· CMTC Email: rmcfarland@cmtc.com
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